Experience:
Freshers
Application Mode: Online
Application Mode: Online
Candidate
Profile:
- Candidate should be a B.E / B. Tech/ME/MTech graduates
- Must be fluent in the English language able to interact verbally with peers, management, marketing and customers in person or on the phone.
- Must be able interact in written form via email, author product documentation and test plans/reports
- Proficiency with HSPICE, ADS, is a highly desirable. Good understanding of dense PCB board technologies and knowledge of Matlab is an added bonus.
- Successful applicants must be able to work on several different projects at the same time and keep management informed on progress and roadblocks.
- Must be able to work with a cross functional team with good communication and collaboration skills.
Job Description:
- Working with LSI silicon and package engineers to develop accurate package models for components.
- Using simulations, establish layout rules that balance signal integrity requirements against BOM and manufacturing cost.
- Performing measurements on board products to verify validity of models and assure safe signal margins are obtained.
- Act as content expert when debugging noise related issues.
- Understanding design tradeoffs which affect EMC and EMI.
- Understanding Power integrity for high speed designs and provides simulations and analysis to improve power integrity.
- Perform channel simulation for SERDES to analyze design margin.
- Perform timing analysis to ensure adequate margin on PCB routing and communicate with Design Engineers and layout engineers to implement all SI and PI rules to meets LSI and industry standards.
- Perform simulations to correlate simulated results with lab measurements
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